產品名稱 : 電子零件膠帶
產品介紹

Description :

Electronic components that support the latest devices... and the Nitto Denko adhesive technology that supports these components For the electronic components needed in the latest electronic devices, the adhesive technologies developed by Nitto Denko over many years include a thermal release tape for precision cutting processes, and porous sheet made of ultrahigh- molecular-weight polyethylene, SUN MAP. In addition, Nitto Denko's paper carrier tapes (for both axial and radial components) are used for conveying electronic components and for automatic mounting. For high-precision condensers, various cutting-edge adhesive technologies, such as Nitto Denko's adhesive tape for condensers, are employed. Inside such products, and during the manufacturing process, fluoroplastic NITOFLON Tapes No.900UL & No. 903UL, and Nitto's surface protection material are used. Nitto Denko's adhesive tape technology contributes to all of these.

Tapes for Electronic Components
PPS Adhesive Tape for Condensers
Cover Tapes for Surface Mounting Electronic Components
Paper Carrier Tapes for Radial Type Electronic Components
Paper Carrier Tapes for Axial Type Electronic Components
Thermal Release Tape
Surface Protection Materials for Electronic Devices
Thermal Release Tape

 

Fluoroplastic Products, NITOFLON
NITOFLON Sheet, No.900UL
NITOFLON Adhesive Tape, No.903UL